Heat dissipating circulatory system with sputtering assembly

ABSTRACT

A heat dissipating circulatory system ( 8 ) includes a pool ( 7 ) for receiving an operating fluid, a pump ( 3 ), a heat spreader ( 2 ) and a condenser ( 4 ). A first pipe ( 51 ) interconnects an output end ( 42 ) of the condenser and an input end ( 71 ) of the pool. A second pipe ( 52 ) interconnects an output end ( 72 ) of the pool and an input end ( 31 ) of the pump. A third pipe ( 53 ) interconnects an output end ( 32 ) of the pump and an input end ( 21 ) of the heat spreader. A fourth pipe ( 54 ) interconnects an output end ( 22 ) of the heat spreader and an input end ( 41 ) of the condenser. The heat spreader includes a fin ( 13 ) and a liquid sputtering assembly ( 1 ). The liquid sputtering assembly includes a plurality of nozzles ( 11 ) and drivers ( 12 ). The operating fluid is directly sputtered onto the fin, thereby providing direct heat exchange.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates generally to heat dissipating circulatory systemsfor dissipating heat from heat-generating apparatus or components, andmore particularly to a heat dissipating circulatory system with asputtering assembly and using a liquid operating fluid.

2. Description of the Prior Art

The operating speed of electronic apparatus such computers, printers andcopiers is becoming progressively higher, and is due in large part tothe increase in electronic transmissions speeds of components of theseapparatus. Correspondingly, the heat dissipation requirements of thesecomponents are increasing too. In many contemporary applications, a fanis fixed on or near such electronic components to dissipate heat. Thefan dissipates heat by utilizing air as the operating medium. Generally,however, the heat dissipating efficiency of the fan is relatively poor.Heat produced in the electronic components cannot be dissipated timelyand efficiently. Furthermore, the fan is prone to produce noise duringoperation.

Various devices have been developed in order to dissipate the heattimely and efficiently, and to avoid noise. For example, China Pat. No.99210734.2 discloses a heat dissipating device using a liquid operatingfluid. The heat dissipating device is adapted to be used for a computer,and comprises a cooling pipe, a pump, at least a fin, and at least aheat dissipating portion. The cooling pipe receives the liquid operatingfluid therein, and the pump is fixed in a suitable position along thecooling pipe. The fin is fixed to a heat-generating chip in thecomputer, and comprises a first pipe connected with the cooling pipe.The heat dissipating portion is fixed to an outer surface of thecomputer, and comprises a second pipe connected with the cooling pipe.The liquid operating fluid circulates in a same direction through theheat dissipating device, and the heat produced by the chip is dissipatedto the external environment. A heat dissipating efficiency of the heatdissipating device is relatively high, and no appreciable noise isgenerated.

In the above-mentioned heat dissipating device, the operating fluid isdriven by the pump to flow into the first pipe of the fin, and absorbsthe heat produced by the chip from the fin via the first pipe. Then theoperating fluid is driven by the pump to flow into the second pipe ofthe heat dissipating portion, and dissipates the heat to the externalenvironment via the heat dissipating portion. Because the heat exchangebetween the operating fluid and the fin must be via the first pipe ofthe fin, the heat dissipating device does not provide direct heatexchange. This effectively reduces the efficiency of the heatdissipating device.

A new heat dissipating circulatory system which overcomes theabove-mentioned problems is desired.

BRIEF SUMMARY OF THE INVENTION

Accordingly, an object of the present invention is to provide a heatdissipating circulatory system which can achieve timely and efficientheat exchange.

To fulfill the above-mentioned object, the present invention provides aheat dissipating circulatory system comprising a pool for receiving anoperating fluid, a pump, a heat spreader and a condenser. A first pipeinterconnects an output end of the condenser and an input end of thepool. A second pipe interconnects an output end of the pool and an inputend of the pump. A third pipe interconnects an output end of the pumpand an input end of the heat spreader. A fourth pipe interconnects anoutput end of the heat spreader and an input end of the condenser. Theheat spreader comprises a fin and a liquid sputtering assembly. Theliquid sputtering assembly comprises a plurality of liquid sputteringelements, and each liquid sputtering element comprises a nozzle and adriver.

The operating fluid is directly sputtered onto the fin via the nozzles.Thus, direct heat exchange occurs between the operating fluid and thefin, unlike in conventional heat dissipating devices. This ensures thatthe heat exchange between the operating fluid and the fins is timely andefficient, and improves a heat dissipating efficiency of the heatdissipating circulatory system.

Other objects, advantages and novel features of the invention willbecome more apparent from the following detailed description when takenin conjunction with the accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a heat dissipating circulatory system ofthe present invention;

FIG. 2 is a schematic, side elevation of a heat spreader of the heatdissipating circulatory system of FIG. 1; and

FIG. 3 is an enlarged, schematic end elevation of a liquid sputteringassembly of the heat spreader of FIG. 2.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Referring to FIG. 1, a heat dissipating circulatory system 8 of thepresent invention comprises a pool 7 as a reservoir for receiving anoperating fluid (not shown), a pump 3 as a circulating driver, a heatspreader 2, and a condenser 4. A first pipe 51 interconnects an outputend 42 of the condenser 4 and an input end 71 of the pool 7. A secondpipe 52 interconnects an output end 72 of the pool 7 and an input end 31of the pump 3. A third pipe 53 interconnects an output end 32 of thepump 3 and an input end 21 of the heat spreader 2. A fourth pipe 54interconnects an output end 22 of the heat spreader 2 and an input end41 of the condenser 4.

The pump 3 is used to drive the operating fluid to flow in a samedirection through the heat dissipating circulatory system 8. In thepreferred embodiment, the pump 3 is a micro pump.

Referring to FIGS. 2 and 3, the heat spreader 2 comprises a fin 13 and acorresponding liquid sputtering assembly 1. The fin 13 is flat and madeof aluminum or copper. The fin 13 is located at a heat source (notshown), and absorbs heat produced by the heat source. The liquidsputtering assembly 1 comprises a plurality of (“n”) liquid sputteringelements (not labeled), and each liquid sputtering element comprises anozzle 11 and a driver 12. A pitch Z between each two adjacent liquidsputtering elements is in the range from 5 micrometers to 50micrometers.

A plurality of check valves 6 are fixed to the first, second, third andfourth pipes 51, 52, 53, 54 respectively. The check valves 6 are used tocontrol a speed and direction of flow of the operating fluid.

In the preferred embodiment, the operating fluid comprises pure waterand a plurality of nanometer-scale particles suspended in the purewater. The nanometer-scale particles are nanometer-scale copperparticles, carbon nanotubes or carbon nanocapsules. Because thenanometer-scale particles are extremely small and have high thermalconductivity, this ensures that the operating fluid has high thermalconductivity. In alternative embodiments, the pure water can be replacedby heptane.

An operating process of the heat dissipating circulatory system 8 is asfollows. Firstly, the pump 3 draws operating fluid out of the pool 7 viathe second pipe 52. The operating fluid flows into the heat spreader 2via the third pipe 53. There, the operating fluid is driven by thedrivers 12 of the liquid sputtering assembly 1 to directly sputter ontothe fin 13 via the nozzles 11 of the liquid sputtering assembly 1. Atthe same time, direct heat exchange occurs between the fin 13 and theoperating fluid. The heat absorbed by the fin 13 is transmitted to theoperating fluid, and the temperature of the liquid operating fluidrises. Then, the heated operating fluid is driven by a pump (not shown)connected with the liquid sputtering assembly 1 to flow into thecondenser 4 via the fourth pipe 54. The condenser 4 cools the operatingfluid, the heat absorbed in the operating fluid is transmitted to theexternal environment, and the temperature of the operating fluid falls.Finally, the cooled operating fluid flows into the pool 7 via the firstpipe 5l. The heat dissipating circulatory system 8 thus continues thiscirculatory process of transmitting heat.

Compared with a conventional heat dissipating device, the heatdissipating circulatory system 8 of the present invention has thefollowing advantages. The operating fluid is directly sputtered onto thefin 13 via the nozzles 11. Thus, direct heat exchange occurs between theoperating fluid and the fin 13. This ensures that the heat exchangebetween the operating fluid and the fins 13 is timely and efficient, andimproves a heat dissipating efficiency of the heat dissipatingcirculatory system 8.

It is to be understood that the above-described embodiment is intendedto illustrate rather than limit the invention. Variations may be made tothe embodiment without departing from the spirit of the invention.Accordingly, it is appropriate that the appended claims be construedbroadly and in a manner consistent with the scope of the invention.

1. A circulatory system for dissipating heat, the circulatory systemcomprising: a condenser; a pool for receiving an operating fluid andwith an input end thereof interconnected with an output end of thecondenser by a first pipe; a pump with an input end thereofinterconnected with an output end of the pool by a second pipe; a heatspreader with an input end thereof interconnected with an output end ofthe pump by a third pipe, and with an output end thereof interconnectedwith an input end of the condenser by a fourth pipe; wherein the heatspreader comprises a fin and a liquid sputtering assembly, the liquidsputtering assembly comprises a plurality of liquid sputtering elements,and each liquid sputtering element comprises a nozzle and a driver. 2The circulatory system as claimed in claim 1, wherein a plurality ofcheck valves are fixed to the first, second, third and fourth pipesrespectively.
 3. The circulatory system as claimed in claim 1, whereinthe operating fluid is water or heptane.
 4. The circulatory system asclaimed in claim 3, wherein a plurality of nanometer-scale particles aresuspended in the operating fluid.
 5. The circulatory system as claimedin claim 4, wherein the nanometer-scale particles are nanometer-scalecopper particles, carbon nanotubes and/or carbon nanocapsules.
 6. Thecirculatory system as claimed in claim 1, wherein a pitch between eachtwo adjacent liquid sputtering elements is in the range from 5micrometers to 50 micrometers.
 7. The circulatory system as claimed inclaim 1, wherein the fin is flat and made of aluminum or copper.
 8. Thecirculatory system as claimed in claim 1, wherein the pump is a micropump.
 9. A heat dissipating system comprising: a fluid reservoir forreceiving an operating fluid; a fluid driver for driving said operatingfluid out of said fluid reservoir; and a heat spreader for receivingsaid operating fluid from said fluid reservoir and further forcedlysputtering said operating fluid out of said heat spreader for heatdissipating before said operating fluid returns to said fluid reservoir.10. The heat dissipating system as claimed in claim 9, wherein said heatspreader has a nuzzle for sputtering.
 11. The heat dissipating system asclaimed in claim 10, wherein said heat spreader further comprises adriver to supply sputtering power for said nuzzle.
 12. The heatdissipating system as claimed in claim 10, wherein said heat spreaderfurther comprises a fin disposed before said nuzzle forheat-interchanging with said sputtered operating fluid.
 13. The heatdissipating system as claimed in claim 9, wherein said operating fluidcomprises a plurality of nanometer-scale particles suspended therein.14. A method for heat dissipating comprising the steps of: reserving anoperating fluid; driving said reserved operating fluid for circulating;and sputtering said operating fluid during said fluid circulating. 15.The method as claimed in claim 14, wherein a row of nozzles is used forsputtering in said sputtering step.
 16. The method as claimed in claim14, wherein said operating fluid has a plurality of nanometer-scaleparticles suspended therein.